Follow any electric vehicle, solar plant or data centre down through its hardware and you reach the same place: a handful of semiconductor devices, switching millions of times a second, deciding how much energy survives the journey.
Above: an uninterruptible power supply. Mains AC is rectified to DC to charge the battery, then inverted back to AC when the supply fails. Both blocks are built from power semiconductors.
Reading, characterising and structuring what components actually do — datasheets, test conditions, temperature and bias behaviour, construction and reliability.
Power semiconductors characterised and engineer-reviewed, and growing every week.
We train them ourselves — graduates into working component and power electronics engineers, continuously since 2017.
Every electrical system has to change the form of its power at least once. Battery to motor. Sunlight to grid. Wall socket to processor. Power electronics is the engineering that makes each of those conversions happen.
It is also where the product is won or lost. Efficiency, size, weight, cost, heat and reliability are all decided here — long before anyone sees the finished thing.
Traction inverters, onboard chargers and battery management. They set range, acceleration, and how much of the battery reaches the wheels.
DC fast chargers. Conversion efficiency decides charging time, running cost, and how much heat the cabinet must shed.
String and central inverters. The largest single determinant of how much of a plant's generation actually reaches the grid.
Bidirectional grid-tied converters — what makes storing renewable generation and releasing it on demand possible.
Power delivery to AI and cloud compute — increasingly the limit on how much capacity a site can host.
Mains AC to regulated DC. The highest-volume category in electronics manufacturing by unit count.
Industry, healthcare, telecom, data centres. Here conversion quality is continuity of service, not efficiency.
Every joint is a motor and every motor needs a drive. A humanoid carries thirty-odd miniature inverters, each tightly constrained on weight and volume.
Variable-frequency and servo drives across automotive, industrial and consumer markets — the largest energy-saving opportunity in each.
A traction inverter, a solar inverter and a data centre power shelf look nothing alike. Inside, they are the same short list of parts, sized differently.
Most are treated as commodity parts. None behave like one.
The switch itself. Sets efficiency, speed, heat — and the size of everything around it.
Turn control signals into the current needed to switch a power device cleanly, millions of times a second.
Microcontrollers and DSPs running the switching algorithm, regulation loops and protection logic.
Store and transfer energy every switching cycle. Usually the largest and heaviest parts present.
Smooth the DC bus and carry ripple current. Often the lifetime-limiting part.
Every watt lost becomes heat to remove. Better devices mean smaller, cheaper, quieter cooling.
Close the control loop and protect the converter from its own failure modes.
Where current enters and leaves. Contact resistance, rating, temperature rise and mating cycles are specified — unlike the board around them, which is custom every time.
In a textbook a capacitor is a number. In a circuit it has resistance that rises as it ages, capacitance that falls under bias, a frequency above which it stops being a capacitor, and a life that halves every ten degrees.
The same is true of every part above. The distance between the ideal and the physical is where products fail. Closing it is what component engineering is.
We work at that level, across six dimensions.
Every number is a measurement made under stated conditions. Change the conditions and the number changes.
Two makers can specify the same parameter in ways that cannot be compared.Almost nothing is a constant. On-resistance climbs with temperature; capacitance collapses under bias.
Project performance at the conditions the design runs at, not the ones it was measured at.Package inductance, stray capacitance, series resistance, leakage, recovery charge, self-resonance.
Ignorable at low frequency. Often the dominant term in a fast converter.Junction to case, case to sink, and the interface between — plus transient impedance, which behaves nothing like the steady-state number.
The thermal path is a circuit. It gets designed, not assumed.Qualification data, derating, wear-out mechanisms and end-of-life — to production-part-approval depth where required.
Decides whether a design that works on the bench still works in ten years.Die attach and bond wire against clip, substrate, encapsulant, core and winding, dielectric, copper weight.
Identical headline specs, different construction, different behaviour. The datasheet rarely says so.Strip the converter back far enough and what remains is a few millimetres of semiconductor, cut from a wafer, packaged, and asked to switch hundreds of amperes without failing for fifteen years.
That is where the performance comes from.
Silicon, silicon carbide or gallium nitride, processed in a fab.
The wafer is cut into individual devices, each one tested.
Assembly and test — bonded, encapsulated, given leads and a thermal path.
Several die combined into one assembly for higher power and easier integration.
Not one product. Each technology owns a different region of voltage, current and speed — and choosing between them is most of the engineering.
The workhorse below a few hundred volts — supplies, DC-DC, smaller drives.
High voltage, high current, moderate speed. Traction, drives, large inverters, grid equipment.
Higher voltage, faster switching, far lower loss than silicon. Behind 800V EV platforms and high-efficiency solar.
The fastest switching available. Enables much smaller chargers, adapters and data centre power stages.
Rectifiers and freewheeling devices, including SiC Schottky where recovery loss matters.
Phase-controlled, for the highest powers — HVDC, large rectifiers, heavy plant.
A die alone cannot be soldered, cooled or connected. The package adds the thermal path — and its own resistance, inductance and failure modes. Same die, different package, different product.
Bolted to a heatsink, generous creepage, serviceable. The four-lead variant adds a Kelvin source pin — increasingly necessary as devices get faster.
Reflow-assembled, cooled through the board. Cheaper at volume — but thermal performance now depends on your copper, not the part.
Low package inductance for fast switching. Top-side-cooled variants take the heat off the board entirely.
Smallest footprint, lowest parasitic inductance. Where every nanohenry counts — GaN stages, point-of-load, dense supplies.
Isolated baseplate, screw terminals, high current, field-replaceable. Where serviceability outweighs density.
Several die on one isolated substrate. The substrate and baseplate become part of the electrical and thermal design.
Engineering-level component and specification work. Not cataloguing, not scraping — reading the documentation the way an engineer has to, and turning it into something a designer can rely on.
Unglamorous, rarely done well, and worth being good at.
What each parameter means, how it was measured, which footnote changes it — and where two makers have specified the same thing incomparably.
How a part is tested and how those tests become published numbers — so a spec can be used knowing what it does and does not guarantee.
How each parameter moves with temperature, bias, current and frequency — including from characteristic curves, where the useful behaviour hides.
Structuring categories deeply enough that comparison across manufacturers is meaningful rather than approximate.
Internal construction, materials, qualification and derating — to the depth a quality process requires.
Projected loss, junction temperature and efficiency at the conditions a design actually runs at.
Our engagements are long-term and we do not discuss client work publicly. Everything described above is capability, not any particular project.
Transport, generation, storage, computing, manufacturing and robotics are all being electrified at once — and every one is limited by how well its components are understood.
Universities teach these parts as ideals, and should. Industry needs engineers who also know them as physical objects. That is not a gap in the curriculum — it is where formal education ends and practice begins.
Closing it is the bottom-up route to quality: not more testing at the end, but more understanding at the start.
Running since 2017. The distinguishing feature is the review loop — trainees do real work early, seniors review and correct every output, and the correction is the teaching.
Your course teaches the ideal component. This is the other half. You will interrogate datasheets, work on real problems early, and have everything reviewed by someone more experienced — until you are the one reviewing.
See current openings and internships →Applied component engineering alongside your existing curriculum — modules on devices and characterisation, supervised project work from live industry problems, and faculty development. Students produce real output, reviewed to professional standard.
The institution keeps the curriculum and the trained faculty.Capacity is being added fast, and it needs engineers who understand devices and applications — a layer that takes longer to build than a plant does. We are open to building a centre of excellence with a state government, national programme or industry body.
Open to conversations now, at any scale.All three are open now. An email is the fastest way to start.
A boutique engineering team, operating since 2017, based in Bangalore and Noida. Electrical, electronics, mechanical, software and AI engineers, working together on component engineering and system-level solutions.
India is building its electronics industry now — fabrication, packaging, design centres, all at once. Every one of them needs engineers who understand components. We train them.
We intend to contribute significantly to India's semiconductor mission, and to the electronics ecosystem taking shape around it.
Nine years of continuous operation in India, well ahead of the current wave of semiconductor policy.
Power semiconductors documented and engineer-reviewed by this team since 2017.
Converter topologies modelled from first principles as part of our engineering work.
Two engineering bases, plus remote teams across India. Registered office at EPIP Whitefield, Bangalore.
Engineering work, training programmes, or partnerships with institutions and government. If any of that is you, get in touch.
For engineering work, training programmes or institutional and government partnerships, write to us and tell us roughly what you need.
We hire and train continuously — graduates, interns and experienced engineers.
DiscoverEE Analytics Pvt Ltd is registered in Bangalore, Karnataka, and also operates from Noida.
Full registered address, company identification and other formal details are shared on request — just ask.